Y. Arin Manav

PhD Candidate · Microsystem Design, Fabrication, and Sensing Applications

PhD candidate at Northeastern University, focused on CMOS-integrated piezoMEMS GHz ultrasound for mechanobiology and electronics metrology, alongside micro/nanofabrication of devices for biomolecular sensing. Also works on the design and additive manufacturing for packaging design and device prototyping.

Career

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Sep 2022 — Present
Ph.D., Electrical and Electronics Engineering
Northeastern University · Boston, MA
GPA4.0/4.0
Sep 2022 — Dec 2024
M.S., Electrical and Electronics Engineering
Northeastern University · Boston, MA
GPA4.0/4.0
Concentration in Microsystems, Materials, and Devices.
Graduate coursework
Analog IC Design Biomedical Microsystems Microwave Circuits for Wireless Communication Micro & Nano Fabrication MEMS Solid State Devices Multiphysics Simulations Mechanics of Soft Materials Semiconductor Packaging
2017 — Dec 2021
B.S., Electrical and Electronics Engineering
University of Illinois Urbana-Champaign · Champaign, IL
Undergraduate coursework
Analog Signal Processing Digital Signal Processing Computer Systems Data Science Digital Systems Electronic Circuits Power Electronics Semiconductor Electronics
2016
Pre-College Program · Quantum Physics
Harvard University · Cambridge, MA
Summer pre-college coursework in quantum physics with supporting mathematics — linear algebra and partial differential equations.
2015 — 2017
International Baccalaureate Diploma Programme
Sept. 2022 — Present
Graduate Research Assistant — AIMS Lab
Northeastern University · Boston, MA
  • Developed techniques for mechanical mapping of cells and soft tissues using a CMOS-integrated piezo-MEMS GHz ultrasound array.
  • Implemented an automated ROI-detection algorithm for GHz pulse-echo reflectometry imaging and a software tool for post-processing imaging data.
  • Designed and tested additively manufactured electronic devices for sensing — microheaters, microcantilevers, coplanar waveguides, and cavity resonators.
  • Investigated stress-gradient-induced bending in AME and FHE devices and packages using the CMOS-integrated GHz ultrasound array.
  • Trained undergraduate and graduate students in designing for additive manufacturing of electronics on an inkjet system with silver-nanoparticle and dielectric inks.
May 2025 — Aug. 2025
RF BAW Filter Design Intern
Skyworks Solutions, Inc. · Andover, MA
  • Taped out BAW filter dies and their packaging; led the design reviews leading up to tape-out.
  • Conducted stack analysis, lumped-element simulations, EM simulations, and layout design using Keysight ADS, Ansys HFSS, and Cadence Virtuoso.
Jan. — Apr. 2026
Teaching Assistant — EECE 7201: Solid State Devices
Northeastern University · Boston, MA
  • Returning TA for the graduate Solid State Devices course; lab tutorials on device-level simulation in Silvaco TCAD.
  • Office hours, homework grading, and simulation feedback.
Sep. 2025 — Jan. 2026
Teaching Assistant — EECE 5698 ST: Biomedical Microsystems
Northeastern University · Boston, MA · Part-time
  • Taught how to set up and run multiphysics simulations on COMSOL for BioMEMS applications.
  • Prepared tutorials for 3D design with Fusion 360 and walkthroughs for accessing course software.
  • Held office hours; graded weekly homework and simulation submissions.
Jan. — May 2025
Teaching Assistant — EECE 5649: CMOS Analog Integrated Circuit
Northeastern University · Boston, MA
  • Led weekly recitations on analog IC schematic and layout simulation in Cadence.
  • Prepared example simulations and homework solutions covering differential amplifier design, linearity and stability analysis, current-mirror Monte Carlo, common-mode feedback design, OTA macromodeling, and spectral analysis.
  • Held office hours; graded weekly homework and simulations.
Jan. — May 2025
Teaching Assistant — EECE 7201: Solid State Devices
Northeastern University · Boston, MA
  • Prepared lab tutorials for device-level simulations on Silvaco TCAD and demonstrated the simulation steps in tutorial sessions.
  • Held office hours; graded weekly homework and simulations.
Aug. — Dec. 2021
Teaching Assistant — Engineering Orientation Seminar
University of Illinois Urbana-Champaign · Champaign, IL
  • Taught 25 undergraduates about campus resources, professionalism, and academic success.
  • Mentored students on research experiences, internships, resumes, and wellness.

Research

2025 · Journal · Extreme Mechanics Letters
Highly switchable and reversible soft sticky adhesives based on thermo-responsive phase separation
Yin Q, Manav YA, Wan Y, Davaji B, Bai R
Extreme Mechanics Letters, vol. 75, 102293.
2025 · Conference · Transducers (IEEE)
GHz Ultrasound for Quantitative Oocyte Mechanobiology
Manav YA, Piasecki A, Lal A, Woods D, Davaji B
Transducers 2025, pp. 526–529. June 29 – July 3, 2025.
2025 · Conference · AIChE Annual Meeting
Optimizing Catholyte Flow-Field Geometries to Enable More Selective and Stable CO₂RR Flow-Based Electrolyzers — A Customizable Approach
Heeschen E, Maddikunta HR, Manav YA, Davaji B, Börnhorst M, Barecka M
2025 AIChE Annual Meeting.
2024 · Journal · HardwareX
Low Cost 3D Printable Flow Reactors for Electrochemistry
Heeschen E, DeLucia E, Manav YA, Roberts D, Davaji B, Barecka MH
HardwareX, vol. 17, e00505.
2024 · Conference · MicroTAS
Additive Manufactured Electronics (AME) for Integrated Microfluidic Impedance Spectroscopy
Yun H, Manav YA, Altin EF, Arzefouni MY, Borenstein J, Davaji B
MicroTAS 2024, October 13–17.
2024 · Conference · FLEX at SEMICON West
3D Printed FHE Microcalorimetric Array
Arzefouni MY, Manav YA, Angell N, Borenstein J, Davaji B
FLEX 2024, July 9–11.
2024 · Conference · IEEE MEMS
Towards GHz Ultrasound Enabled Noninvasive Hydrogel Metrology for Mechanobiology
Manav YA, Sebastian F, Baskota A, Kuo JC, Amini R, Lal A, Davaji B
IEEE MEMS 2024, pp. 276–279.
2025 · Poster · BU CMTM Annual Symposium
GHz Ultrasound for Microscale Mapping of Hydration Induced Stiffness Changes
Manav YA, Ozyilmaz E, Davaji B
Boston University Center for Multiscale & Translational Mechanobiology Annual Symposium.
2025 · Conference · Global Summit on Mechanobiology & Mechanomedicine
GHz Ultrasound for Physical Sensing
Manav YA, Piasecki A, Davaji B
Awarded 2nd-place poster prize. March 6–7, 2025.
2024 · Conference · FLEX at SEMICON West · Best Poster
Flexible Hybrid Electronics (FHE) Metrology Enabled by GHz Ultrasound
Manav YA, Davaji B, Borenstein J, Lal A, Kuo J, Baskota A
Awarded Best Poster — Innovators of the Future, FLEX 2024 at SEMICON West. July 9–11, 2024.
March 2025
2nd Place — Global Summit on Mechanobiology & Mechanomedicine
For the poster "GHz Ultrasound for Physical Sensing".
July 2024
1st Place — FLEX 2024 at SEMICON West
Innovators of the Future Student Poster Awards, sponsored by SEMI, FlexTech, and FlexEnable. For the poster "Flexible Hybrid Electronics Metrology Enabled by GHz Ultrasound".

Projects

2026 · Desktop app · React + TypeScript / Electron · Python
Pixel Probe - Ultrasound Image Analysis Suite
A cross-platform tool for radio-frequency (RF) ultrasound data: I/Q demodulation, region-of-interest measurement, automated detection, and publication-ready figure/video export. (Research use only, not intended for medical use.)
Python DSP · Hilbert demod React + TypeScript Electron Matplotlib
View project →

Skills & Tools

Ansys HFSS Cadence AWR Cadence Virtuoso Keysight ADS
Layout
Mask design GDS export
Cleanrooms
Harvard CNS Kostas Nanofabrication Lab MIT.nano
Deposition
PECVD Sputter deposition (PVD) Sputter coating
Etching
ICP-RIE Plasma asher
Lithography
E-beam Maskless aligner Direct-write laser
Metrology
SEM XRD Thin-film reflectometry Ellipsometry Stylus profilometry White-light interferometry
Languages
Python MATLAB C C++
Python Stack
NumPy SciPy Pandas Matplotlib OpenCV PyTorch scikit-learn
Multiphysics
COMSOL Multiphysics Abaqus
Device TCAD
Silvaco TCAD (ATLAS)
IC Design
Cadence Virtuoso LTSpice
Mechanical CAD
Autodesk Fusion 360
Layout
KLayout

Get in touch

Open to industry conversations, particularly around ultrasound, RF, MEMS, and R&D. The fastest way to reach me is LinkedIn.

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